Indledning
This instruction manual provides essential information for the proper installation, operation, and maintenance of your Gelid Solutions HeatPhase Ultra Thermal Pad. Designed for high-performance thermal management, this non-electrical conductive pad ensures efficient heat transfer for your CPU, particularly compatible with AMD processors. Please read this manual thoroughly before use to ensure optimal performance and safety.
Sikkerhedsoplysninger
Always exercise caution when handling computer components. Ensure your system is powered off and unplugged before installation. Avoid touching the thermal pad surface with bare hands to prevent contamination. This product is non-electrical conductive, minimizing the risk of short circuits, but proper handling is still recommended.
Produkt overview
The Gelid Solutions HeatPhase Ultra Thermal Pad offers advanced thermal interface material technology. Key features include:
- Ultra Heat Conductivity: Engineered for rapid and efficient heat dissipation, keeping devices cool under intense conditions.
- Easier Application and Removal: Designed for straightforward installation and removal, simplifying the process for all users.
- Ultra-Durable and Non-Curing: Maintains effectiveness over time without curing or hardening, ensuring consistent performance.
- Non-Electrical Conductive: Provides superior thermal management without the risk of electrical damage or short circuits.
- No Bleeding & User Friendly: Designed to stay in place without spreading, ensuring a clean and trouble-free experience.
Figure 1: Illustration of the thermal pad's ultra heat conductivity.
Figure 2: The thermal pad is non-electrical conductive, ensuring safety for electronic components.
Figure 3: The thermal pad is user-friendly and does not bleed, as indicated by the thermal impedance graph.
Opsætning og installation
Follow these steps carefully for proper installation of the HeatPhase Ultra Thermal Pad:
- Forberedelse:
- Ensure your CPU and heatsink surfaces are clean and free of any old thermal paste or debris. Use isopropyl alcohol and a lint-free cloth for best results.
- For easier handling, some users find it beneficial to place the thermal pad in a freezer for 15-20 minutes before application. This can make the pad firmer and less prone to stretching during placement.
- Anvendelse:
- Carefully peel off one side of the protective film from the thermal pad. It is often recommended to peel the clear film first, leaving the pad attached to the white backing.
- Align the thermal pad precisely over the CPU's Integrated Heat Spreader (IHS). Gently place it down, ensuring it covers the entire surface.
- Once positioned, gently rub the surface of the pad with a clean, flat object (like a credit card or ID) to help remove any trapped air and ensure good contact.
- Carefully peel off the remaining protective film (the white backing) by lifting one edge and slowly rolling it back, parallel to the pad.
- Installation af køleplade:
- Install your CPU cooler/heatsink as per its manufacturer's instructions. Ensure even pressure is applied when mounting the cooler to achieve optimal contact with the thermal pad.
Figure 4: The thermal pad positioned on a CPU, with protective films.
Figure 5: The thermal pad is designed for easy application and removal from cooling components.
Drift
Once installed, the Gelid Solutions HeatPhase Ultra Thermal Pad operates passively, continuously transferring heat from your CPU to the heatsink. No further user interaction is required for its operation. The pad is designed to maintain its thermal performance over extended periods without drying out or hardening.
Opretholdelse
The HeatPhase Ultra Thermal Pad is designed for long-term stability and does not require regular re-application like traditional thermal pastes. Its non-curing and ultra-durable properties ensure consistent performance over its lifespan. Periodically, you may wish to clean dust from your CPU cooler fins to maintain optimal airflow and cooling efficiency, but the thermal pad itself requires no direct maintenance.
Figure 6: The thermal pad is ultra-durable and non-curing, ensuring long-lasting performance.
Fejlfinding
If you experience higher-than-expected CPU temperatures after installation, consider the following:
- Improper Contact: Ensure the CPU cooler is mounted correctly and applies even pressure across the thermal pad. Re-seat the cooler if necessary.
- Forurening: Verify that both the CPU IHS and heatsink base were thoroughly cleaned before application. Any dust or residue can hinder heat transfer.
- Incorrect Size/Placement: Confirm the thermal pad fully covers the CPU's IHS.
- Cooler Performance: Ensure your CPU cooler itself is functioning correctly (fans spinning, pump working for AIOs).
If issues persist, consider carefully removing the thermal pad, cleaning both surfaces, and re-applying a new pad or traditional thermal paste to rule out application errors.
Specifikationer
| Attribut | Værdi |
|---|---|
| Mærke | Gelid Solutions |
| Model | HeatPhase Ultra |
| Dimensions (AMD version) | 40 x 40 x 0.2 mm |
| Termisk ledningsevne | 8.5 W/mk |
| Driftstemperaturområde | -50 ~ 125°C |
| Phase Transition Temperature | 45°C |
| Tæthed | 2.8 ~ 0.2g.cm³ |
| Volumenresistivitet | 1.0x10¹³ Ω.cm |
| Non-Electrical Conductive | Ja |
Figure 7: Detailed technical specifications of the HeatPhase Ultra Thermal Pad.
Garanti og support
For detailed warranty information, please refer to the official Gelid Solutions website or the product packaging. For further technical assistance, product inquiries, or support, please visit the Gelid Solutions Store on Amazon eller deres officielle virksomhed webwebsted.
